Winbond 批准 22 亿美元晶圆厂扩产计划，寻求与 10 家客户签订长期协议

Winbond's board has approved approximately NT$73.1 billion (approx. US$2.23 billion) in capital spending to expand its Kaohsiung wafer fab, as the Taiwanese memory chipmaker prepares to select 10 strategic customers for long-term agreements that would reserve production capacity from 2029 through 2032.

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