EE Times· Aaron Fellis, corporate vice president and general manager, Wet Equipment Technology Systems, Lam Research·· 1 天前
Lam Research 谈 AI 封装挑战：面板级封装加速崛起的 5 个原因
The AI Packaging Challenge: 5 Reasons Panels Are Gaining Momentum
事实摘要
Lam Research 湿法设备技术系统部门副总裁 Aaron Fellis 撰文列出面板级封装加速崛起的 5 个原因，指出 AI 封装尺寸正超出传统晶圆制造极限。文章称面板级封装以方形或矩形面板替代圆形晶圆，可提升面积利用率并容纳更大封装，但良率、工艺控制、均匀性、自动化、吞吐量和行业标准化仍是待解难题。Lam Research 称已在先进封装领域布局超过二十年，并正投资面板级研发与制造能力。
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正文 · 原文摘要
As AI pushes chip packages beyond traditional wafer limits, panel-level processing is emerging as a critical path to scale advanced packaging. The post The AI Packaging Challenge: 5 Reasons Panels Are Gaining Momentum appeared first on EE Times .
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来源：EE Times · eetimes.com