imec 发布垂直堆叠 DRAM-on-GPU 热设计研究
Vertical DRAM Stacking Expands Thermal Design Space Beyond HBM-on-GPU (imec)
imec 研究人员发表论文《Beyond HBM-on-GPU: Thermal Design Envelope for 3D Volumetric DRAM-on-GPU Integration》，评估将 DRAM 裸片垂直旋转堆叠在 GPU 上方、并在其间设置散热腔的 3D 内存架构，作为 2.5D HBM 与直接堆叠 HBM-on-GPU 之外的替代方案。
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Researchers at imec published “Beyond HBM-on-GPU: Thermal Design Envelope for 3D Volumetric DRAM-on-GPU Integration.” Summary: Researchers evaluated a 3D memory architecture that rotates DRAM dies vertically above a GPU and places cooling cavities between them as an alternative to conventional 2.5D HBM and direct-stacked HBM-on-GPU. Package-level thermal simulations examined stack height, memory capacity and organization,... » read more The post Vertical DRAM Stacking Expands Thermal Design Space Beyond HBM-on-GPU (imec) appeared first on Semiconductor Engineering .
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来源：Semiconductor Engineering · semiengineering.com