DigiTimes· DIGITIMES·· 1 天前
Applied Materials 拟将 Besi 持股提高至约 20%
Applied Materials to raise Besi stake to 20% as hybrid-bonding orders surge
事实摘要
Applied Materials 计划将所持荷兰半导体设备商 Besi 的股份从 9% 提高至约 20%，以加深在先进芯片封装领域的参与。双方此前联合开发了 Kinex 晶圆对晶圆混合键合系统，报道称混合键合设备需求正在加速。
原文与核验
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正文 · 原文摘要
Applied Materials plans to increase its stake in Dutch semiconductor equipment maker BE Semiconductor Industries (Besi) to approximately 20% from 9%, deepening its involvement in advanced chip packaging as demand for hybrid-bonding equipment accelerates.
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来源：DigiTimes · digitimes.com
所属事件：应用材料拟增持Besi股份至约20%