MCL、PVA TePla 与 ASE 发表 AI 图像增强检测倒装芯片互连缺陷论文
AI Image Enhancement Improves Detection Of Flip-Chip Interconnect Defects (MCL, PVA TePla, ASE)
Materials Center Leoben、PVA TePla 与 ASE 的研究人员发表论文《AI-Based Image Enhancement Improves Detection of Interconnect Defects in Microelectronic Packaging》。
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Researchers at Materials Center Leoben, PVA TePla, and Advanced Semiconductor Engineering (ASE) published “AI-Based Image Enhancement Improves Detection of Interconnect Defects in Microelectronic Packaging.” Abstract Excerpt: “Traditional failure-analysis (FA) methods face growing challenges due to the increasing miniaturization and complexity of modern semiconductor devices. In particular, the detection of cracks in the extreme low K... » read more The post AI Image Enhancement Improves Detection Of Flip-Chip Interconnect Defects (MCL, PVA TePla, ASE) appeared first on Semiconductor Engineering .
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来源：Semiconductor Engineering · semiengineering.com
所属事件：研究团队发表AI增强倒装芯片缺陷检测论文