DigiTimes· DIGITIMES·· 1 小时前
三星据报拟建2nm晶圆厂扩产HBM基片
Samsung reportedly plans 2nm fab to boost HBM base-die output
事实摘要
据DigiTimes报道，三星电子计划在韩国龙仁器兴园区建设一座2nm与4nm级晶圆代工厂，用于扩大HBM所用逻辑基片（base die）的产量。报道称该厂投资估算为25万亿韩元，具体产能与时间表未披露。
原文与核验
这条信号在站内保留事实摘要与战略研判。完整内容和上下文请以原文为准；融资、并购与技术效果以原始披露为准。
正文 · 原文摘要
Samsung Electronics is preparing to build a 2nm- and 4nm-class foundry fab at its Giheung campus in Yongin, South Korea, to expand production of logic base dies used in high-bandwidth memory (HBM). The fab is estimated to cost KRW25 trillion (approx. US$18.6 billion), with the broader project potentially reaching KRW30 trillion if an existing production line is converted into an advanced packaging facility, Seoul Economic Daily reported on November 4.
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来源：DigiTimes · digitimes.com