Semiconductor Engineering· Siemens EDA·· 4 小时前
3D-IC 信号完整性：从硅中介层到系统签核
3D-IC Signal Integrity: From Silicon Interposers To System Signoff
事实摘要
Siemens 的 Innovator3D IC 提供统一系统级环境，将架构探索、电磁提取、通道仿真、协议合规验证与最终系统级签核整合为无缝工作流。随着 AI 与 HPC 架构采用基于先进平台的 chiplet 设计，信号完整性需从组件级验证转向完整的系统级通道分析。
原文与核验
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正文 · 原文摘要
A unified, system-level environment that aggregates several proven technologies into a seamless workflow spanning architecture exploration, electromagnetic extraction, channel simulation, protocol compliance verification, and final system-level signoff. The post 3D-IC Signal Integrity: From Silicon Interposers To System Signoff appeared first on Semiconductor Engineering .
来源只提供摘要，完整内容请打开原文。
来源：Semiconductor Engineering · semiengineering.com