DigiTimes· DIGITIMES·· 3 小时前
Ibiden 扩大面向 Intel 的 AI 封装基板产能，2029 年起供货
Ibiden expands AI packaging substrate capacity for Intel from 2029
事实摘要
Ibiden 计划扩大面向 Intel 的 AI 封装基板产能，相关产能将从 2029 年起供应。原文未披露扩产金额、具体产能规模及工厂选址等细节。
原文与核验
这条信号在站内保留事实摘要与战略研判。完整内容和上下文请以原文为准；融资、并购与技术效果以原始披露为准。
正文 · 原文摘要
Ibiden on October 29 raised its fiscal 2026 forecast, projecting consolidated net profit to rise 40% year-over-year to JPY89 billion (US$563 million) and revenue to increase 36% to JPY565 billion. The company also announced an additional JPY151 billion in capital investment to expand advanced IC packaging substrate capacity for generative AI servers and CPUs.
来源只提供摘要，完整内容请打开原文。
来源：DigiTimes · digitimes.com