DigiTimes· Yunnie Cheng·· 4 小时前
Kinsus Tech 研究洞察：更大尺寸 AI 芯片封装面临三大挑战
Research Insight: Kinsus Tech identifies three challenges for larger AI chip packages
事实摘要
Kinsus Interconnect Technology 研发副总裁 Ting-Hao Lin 在 2026 TPCA Show 上指出，AI 算力需求激增正推动先进封装向更大尺寸演进，并识别出更大 AI 芯片封装的三大挑战。
原文与核验
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正文 · 原文摘要
Surging demand for AI computing is driving advanced packaging toward larger form factors, according to Ting-Hao Lin, R&D vice president at Kinsus Interconnect Technology, speaking at the 2026 TPCA Show. To support this trend, substrate materials must deliver low warpage and exceptional dimensional stability while overcoming challenges in thermal expansion mismatches and structural stress.
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来源：DigiTimes · digitimes.com