欧盟芯片政策推动欧洲超快激光初创扩产

Several startups see a big opportunity to build the next generation of ultrafast lasers, a crucial component in high-end chip manufacturing, in Europe. In June 2026, the European Commission proposed legislation and strategies to reinforce Europe’s competitiveness and independence in the semiconductor and AI ecosystems. Now, one startup is breaking ground on a factory in Lithuania in October. “Sovereignty isn’t an abstract policy word for us—it’s become the reason funding, partners, and attention are available at all,” says Celia Millon, CEO of RayVen Laser GmBH , in Germany. The EU’s proposed “ Chips Act 2.0. ” would support the broader computer chip supply chain—including design, materials, and processing equipment like ultrafast lasers. Millon says that shift means significant public funding can reach small startups like hers. Independent market research puts the global ultrafast-laser market at roughly US $2.4 billion in 2025, growing at around 20 percent a year to reach over $10 billion by the early 2030s. It cites semiconductor miniaturization and advanced packaging as leading drivers alongside precision manufacturing and medical applications. Femtosecond fledglings Ultrafast lasers—ones that fire extremely short, femto- to picosecond-long pulses of high-energy light—are among the most valuable tools for advanced material processing. They enable highly accurate processing without causing heat damage to the surrounding material. Ultrafast laser processing is essential for advanced chip components that enable faster data transfer. For example, components called interposers—the wiring layers that help connect stacked chiplets in advanced semiconductor packages —require tiny laser-drilled holes or “through-glass vias,” which manufacturers then fill with copper to route electrical signals. “This is like 3D-printing technology but in glass,” says Nikolajus Gavrilinas, CEO and cofounder of Lithuanian laser startup Litilit. Other applications include PCB probe cards an

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