中南大学研究通过 Cu@Ag 颗粒表面凸起工程降低光伏浆料银耗
Chinese scientists seek to reduce silver consumption in copper–silver metallization pastes
中南大学研究人员考察了银包铜（Cu@Ag）粉末颗粒表面凸起密度对导电浆料流变性能和导电性的影响，所用浆料银含量仅 17 wt%。提高凸起密度使触变恢复率从 72.1% 升至 83.2%、线性黏弹区从 11.96 Pa 扩至 23.34 Pa，高凸起密度浆料体电阻率达 0.72 × 10⁻⁴ Ω·cm，且未额外添加纳米银颗粒。
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Chinese researchers have developed low-silver copper–silver (Cu@Ag) conductive pastes by engineering particle surface protrusions to improve electrical conductivity and rheological performance. The approach could reduce silver consumption and material costs in photovoltaic metallization without compromising paste performance. The post Chinese scientists seek to reduce silver consumption in copper–silver metallization pastes appeared first on pv magazine Global .
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来源：pv magazine · pv-magazine.com