BIWIN 将在 electronica 2026 展示面向 AI 与边缘的存储方案
BIWIN to Show Storage Solutions for AI and the Edge at electronica 2026
BIWIN 将于 11 月 10-13 日在德国慕尼黑 electronica 2026 展出面向 AI 基础设施、工业边缘计算、智能汽车与嵌入式设备的存储产品。其中 SP5010 企业级 SSD 单盘容量达 122.88 TB，SP509/SP519 顺序读写最高 14,700/9,000 MB/s；TGS601 工业 SSD 可同时录制最多 24 路视频。
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Gear up for the AI era. From 122.88 TB enterprise SSDs to integrated embedded memory and Mini SSDs, BIWIN will showcase storage solutions built specifically for a new generation of electronic systems. BIWIN, a leading provider of memory and storage solutions, will exhibit at electronica 2026, November 10-13 at Trade Fair Center Messe München in […] The post BIWIN to Show Storage Solutions for AI and the Edge at electronica 2026 appeared first on EE Times .
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来源：EE Times · eetimes.com