Semiconductor Engineering· Kaladhar Radhakrishnam·· 3 天前
堆叠芯片多芯片架构：性能扩展与供电之间的权衡
Stacked-Die Multi-Chip Architectures: The Tradeoff Between Scaling And Power Delivery
事实摘要
Intel Foundry 在供电白皮书中提出将电压调节移近负载，以应对堆叠芯片多芯片架构下电流密度和独立电压域数量上升带来的供电挑战。其技术组合包括 CoaxMIL 磁电感、全电容式 IVR chiplet C2VR 以及 IVR chiplet 架构，可降低封装内电流密度、提升调节带宽并减少对大容量去耦电容网络的依赖。
原文与核验
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正文 · 原文摘要
Integrated voltage regulators reduce current density, provide higher regulation bandwidth, and reduce reliance on large decoupling capacitor networks. The post Stacked-Die Multi-Chip Architectures: The Tradeoff Between Scaling And Power Delivery appeared first on Semiconductor Engineering .
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来源：Semiconductor Engineering · semiengineering.com