DigiTimes· Lily Hess·· 3 小时前
TLB 开发 SOCAMM3 基板，越南工厂将动工
TLB develops SOCAMM3 substrates; Vietnam plant to break ground
事实摘要
韩国存储模组基板厂商 TLB 已启动 SOCAMM3 基板开发，SOCAMM3 是面向 AI 服务器的下一代低功耗内存模组，TLB 正与国内外两家主要存储客户合作推进。TLB 的越南工厂即将破土动工。
原文与核验
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正文 · 原文摘要
South Korean memory module substrate maker TLB has begun developing substrates for SOCAMM3, a next-generation low-power memory module for AI servers, with two major memory customers at home and abroad, according to sources. The company expects SOCAMM3 to enter mass production in 2028 as it expands SOCAMM2 production and builds capacity to retain its position in the high-end memory module substrate market.
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来源：DigiTimes · digitimes.com
所属事件：TLB启动SOCAMM3内存模组基板开发