DigiTimes· Sherri Wang·· 3 小时前
Simmtech 加码 SOCAMM 投资，BT 基板供给趋紧
Simmtech steps up SOCAMM investment as BT substrate supply tightens
事实摘要
据 DigiTimes 报道，Simmtech 加大 SOCAMM 相关投资，背景是 BT 基板供给趋紧。包括三星电机（Semco）在内的主要封装基板厂商正把资本开支集中到高层数大尺寸 ABF 基板，用于内存封装的 BT 基板扩产仍然有限。
原文与核验
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正文 · 原文摘要
Major package substrate makers, including Samsung Electro-Mechanics (Semco), are concentrating capital spending on large, high-layer-count ABF substrates, while capacity expansion for BT substrates used in memory packaging remains limited. With BT substrate supply tightening and demand for low-power SOCAMM memory modules rising, South Korea's Simmtech could benefit from its business in both memory package substrates and module PCBs.
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来源：DigiTimes · digitimes.com